导热凝胶
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SE9186导热胶

2022-06-18 10:30:00
SE9186导热胶
详细介绍:

道康宁 陶熙 陶氏 杜邦 SE9186导热粘合剂

 Features &  Benefits

Fast tack-free room temperature cure

Flowable 

Controlled silicone volatility

Cures to soft, low stress elastomer

No added solvents 

No mixing required 

Room temperature cure, no ovens required 

Faster in-line processing at room temperature with option for heat acceleration 

Able to flow, fill or self-leveling after dispensing 

Reduced potential for silicone volatiles

Composition

1-part, translucent or white 

Polydimethylsiloxane 

Applications 

Sealing of electronic equipment and modules

Parts fixing on circuit board 

Sealing against potential stress cracks 

Typical Properties 

Specification Writers: These values are not intended for use in preparing specifications.

Property Unit Result 

One part or Two part One Color Black, Translucent or White Viscosity cP Pa-sec 64000 64 Specific Gravity (Cured) 1.03 Tack-Free Time at 25°C minutes 8 Tensile Strength Psi MPa kg/cm2 360 2.5 25 Elongation % 550 Adhesion Lap Shear (glass) Psi MPa N/cm2 185 1.3 130UNRESTRICTED – May be shared with anyone ®™Trademark of The Dow Chemical Company (“Dow”) or an affiliated company of Dow DOWSIL™ SE 9186 Black, Clear or White Adhesive Page 2 of 4 © 2019 The Dow Chemical Company. All rights reserved. Form No. 11-3275-01 A

Typical Properties (Cont.) Property Unit Result 

Durometer Shore A 20

Dielectric Strength volts/mil kV/mm 575 23 

Volume Resistivity ohm*cm 2.0 E+16 

Content of Low Molecular Siloxane (D4-D10):

 Clear version / White version ppm 35 / 45 

Content of Low Molecular Siloxane (D4-D20):

 Clear version / White version ppm 230 / 300 

Description 

DOWSIL™ brand one-part moisture cure adhesives are generally cured at room  temperature and in an environment of 30 to 80 percent relative humidity eliminating the  need for curing ovens and the associated costs of energy and capital. Greater than 90  percent of full physical properties should be attained within 24 to 72 hours and varies  according to product. Faster manufacturing throughput can be achieved since the adhesive  and component can be handled in much shorter times of about 10 to 120 minutes,  depending on the adhesive selected and the amount applied. These adhesives are not  typically used in highly confined spaces or where a deep section cure is required as they  generally cure from the exposed surface inward at a rate of 0.25 inch per seven days. Cure  progresses from the outer exposed surface and is dependent on the moisture in the air.  Working time is generally a few minutes to an hour for these products until a surface skin  begins to form. Mild heat below 60°C (140°F) may be used to increase through-put by  accelerating the cure. DOWSIL™ brand silicone adhesives retain their original physical and  electrical properties over a broad range of operating conditions which enhance the reliability  of and service life of electronic devices. The stable chemistry and versatile processing  options of these adhesives offer benefits for a variety of electronics needs from increasing  component safety and reliability, reducing total cost or increasing the performance envelope  of devices or modules.

Application  Methods 

Simple needle dispensing systems

Automated systems are normally used for high volume processes

Manual dispensing for low volumes 

Preparing  Surfaces

All surfaces should be thoroughly cleaned and/or degreased with DOWSIL™ brand OS  Fluids, naphtha, mineral spirits, methyl ethyl ketone (MEK) or other suitable solvent.  Solvents such as acetone or isopropyl alcohol (IPA) do not tend to remove oils well, and any  oils remaining on the surface may interfere with adhesion. Light surface abrasion is  recommended whenever possible, because it promotes good cleaning and increases the  surface area for bonding. A final surface wipe with acetone or IPA is also useful. Some  cleaning techniques may provide better results than others; users should determine the best  techniques for their particular applications.

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地址:广州市增城新塘镇群星村黄头社大岭山一号三楼301室