导热凝胶
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DOWSILTC-5026导热硅脂

2022-05-23 14:47:25
DOWSILTC-5026导热硅脂
详细介绍:

DOWSIL™ TC-5026 Thermally Conductive Compound

 

 


Gray, flowable, non-curing thermally conductive compound

Features & Benefits

· Solventless formulation

· Flowable

· Non-curing – no need for curing ovens

· Capable of achieving thin Bond Line Thickness for optimum performance

· Very low thermal resistance

· High thermal conductivity

· Conducts heat away from sensitive components

Composition

· Thermally conductive filler

· Polydimethylsiloxane matrix

Applications

· DOWSIL™ TC-5026 Thermally Conductive Compound is designed to provide efficient thermal transfer for the cooling of MPU in servers, desktops, notebooks, and game consoles

 

Typical Properties

Specification Writers: These values are not intended for use in preparing specifications.

 

Property

Unit

Result

One or Two-part


One

Color


Gray

Viscosity

cP

100,000


mPa-sec

100,000


Pa-sec

100

Specific Gravity (Uncured)


3.5

NVC (Non Volatile Content)

%

99.95

Thermal Conductivity

btu/hr-ft-°F

1.7


W/mK

2.9

Thermal Resistance at 40 psi

°C-cm2/W

0.03



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