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DOWSIL™ TC-5026 Thermally Conductive Compound
Gray, flowable, non-curing thermally conductive compound | |
Features & Benefits | · Solventless formulation · Flowable · Non-curing – no need for curing ovens · Capable of achieving thin Bond Line Thickness for optimum performance · Very low thermal resistance · High thermal conductivity · Conducts heat away from sensitive components |
Composition | · Thermally conductive filler · Polydimethylsiloxane matrix |
Applications | · DOWSIL™ TC-5026 Thermally Conductive Compound is designed to provide efficient thermal transfer for the cooling of MPU in servers, desktops, notebooks, and game consoles |
Specification Writers: These values are not intended for use in preparing specifications.
Property | Unit | Result |
One or Two-part | One | |
Color | Gray | |
Viscosity | cP | 100,000 |
mPa-sec | 100,000 | |
Pa-sec | 100 | |
Specific Gravity (Uncured) | 3.5 | |
NVC (Non Volatile Content) | % | 99.95 |
Thermal Conductivity | btu/hr-ft-°F | 1.7 |
W/mK | 2.9 | |
Thermal Resistance at 40 psi | °C-cm2/W | 0.03 |
