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• DOWSIL™ TC-5121C Thermally Conductive Compound is designed to provide efficient导热硅脂

2022-05-23 14:46:35
• DOWSIL™ TC-5121C Thermally Conductive Compound is designed to provide efficient导热硅脂
详细介绍:

DOWSIL™ TC-5121C Thermally Conductive Compound 

UNRESTRICTED – May be shared with anyone ®TMTrademark of The Dow Chemical Company (“Dow”) or an affiliated company of Dow DOWSIL™ TC5121C Thermally Conductive Compound Page 1 of 3 © 2017 The Dow Chemical Company. All rights reserved. Form No. 11-3087-01 C Gray, flowable, non-curing thermally conductive compound 

Features &  Benefits 

Solventless formulation 

Easy application 

Low thermal resistance 

High thermal conductivity 

Good stability and reliability

Composition

Filled polydimethylsiloxane

Applications 

DOWSIL™ TC-5121C Thermally Conductive Compound is designed to provide efficient

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