DOWSIL™ TC-5625C Thermally Conductive Compound
Gray, flowable, non-curing thermally conductive compound
Features & Benefits
· Solventless formulation
· Easy application
· Low thermal resistance
· High thermal conductivity
· Good stability and reliability
· Filled polydimethylsiloxane
· DOWSIL™ TC-5622 Thermally Conductive Compound is designed to provide efficient
thermal transfer for the cooling of modules, including computer MPUs and power modules.
Specification Writers: These values are not intended for use in preparing specifications.
Specific Gravity (Uncured)
Thermal Resistance at 25 N/cm2
Bond Line Thickness