导热凝胶
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DOWSILTC-5622导热硅脂

2022-05-23 14:46:10
DOWSILTC-5622导热硅脂
详细介绍:

DOWSIL™ TC-5625C Thermally Conductive Compound



Gray, flowable, non-curing thermally conductive compound

Features & Benefits

· Solventless formulation

· Easy application

· Low thermal resistance

· High thermal conductivity

· Good stability and reliability

Composition

· Filled polydimethylsiloxane

Applications

· DOWSIL™ TC-5622 Thermally Conductive Compound is designed to provide efficient

thermal transfer for the cooling of modules, including computer MPUs and power modules.

Typical Properties

Specification Writers: These values are not intended for use in preparing specifications.

Property

Unit

Result

Viscosity

cP

Pa-sec

95,000

95

Specific Gravity (Uncured)


2.5

Thermal Conductivity

W/mK

4.3

Thermal Resistance at 25 N/cm2

ºC*cm2/W

0.06

Bond Line Thickness

Inch mm

0.0008

0.02


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